Research progress of the liquid cold plate cooling technology for server electronic chips: A review

doi:10.1002/er.7979

GIEC OpenIR

	Research progress of the liquid cold plate cooling technology for server electronic chips: A review
	Zhou, Weinan 1,2,3; Dong, Kaijun1,3 ; Sun, Qin 1,3; Luo, Weimin1,3 ; Zhang, Bobo 1,3; Guan, Shengli 4; Wang, Guangwu 4
	2022-04-26
发表期刊	INTERNATIONAL JOURNAL OF ENERGY RESEARCH
ISSN	0363-907X
页码	22
通讯作者	Sun, Qin(sunqinsq@hotmail.com)
摘要	A significant quantity of research has been dedicated to the application of liquid cold plates to eliminate the high heat flux in server electronic chips. Traditional parallel straight microchannel liquid cold plates suffer from low heat flux density with uneven flow distribution, which poses a serious challenge to high-performance server chip heat dissipation. This paper reviews recent research progress in geometry optimization, interrupted structures, channel patterns, and two-phase flow of liquid cold plates. The optimal geometry parameters of rectangular cross-sectional microchannels including the aspect ratio, length, and hydraulic diameter are summarized. Inquest of higher thermal performance, various interrupted structures (ribs, pin fins, etc.), special channel patterns (wavy-shaped, zigzag-shaped, fractal, serpentine, and double-layered microchannels, etc.), and two-phase flow on the liquid cold plate are applied to promote fluid-turbulivity and increase heat transfer area, meanwhile they lead to more pressure drop. Furthermore, it is an essential approach to commercialize liquid cold plates by applying the academic and prototype of the liquid cold plate to manufacturing and liquid cooling system solutions. In the end, this review provides a discussion about the limitations of current research on liquid cold plates and an outlook on future research directions.
关键词	heat transfer enhancement liquid cold plate microchannel server electronics chips
DOI	10.1002/er.7979
关键词[WOS]	MICROCHANNEL HEAT SINK ; THERMAL-HYDRAULIC PERFORMANCE ; FLUID-FLOW CHARACTERISTICS ; FAN-SHAPED RIBS ; ASPECT RATIO ; LAMINAR-FLOW ; HYDROTHERMAL PERFORMANCE ; PRESSURE CHARACTERISTICS ; NUMERICAL OPTIMIZATION ; TRANSFER SIMULATIONS
收录类别	SCI
语种	英语
资助项目	Guangdong Basic and Applied Basic Research Foundation[2019A1515111177] ; Guangzhou Science and Technology Project[202206010026] ; International Cooperation Project of Guangzhou Development District, China[2019GH01]
WOS研究方向	Energy & Fuels ; Nuclear Science & Technology
项目资助者	Guangdong Basic and Applied Basic Research Foundation ; Guangzhou Science and Technology Project ; International Cooperation Project of Guangzhou Development District, China
WOS类目	Energy & Fuels ; Nuclear Science & Technology
WOS记录号	WOS:000787608600001
出版者	WILEY
引用统计	被引频次：9[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.giec.ac.cn/handle/344007/36301
专题	中国科学院广州能源研究所
通讯作者	Sun, Qin
作者单位	1.Chinese Acad Sci, Guangzhou Inst Energy Convers, Guangzhou, Peoples R China 2.Univ Chinese Acad Sci, Beijing, Peoples R China 3.Guangdong Prov Key Lab New & Renewable Energy Res, Guangzhou, Peoples R China 4.Guangzhou Goaland Energy Conservat Tech Co Ltd, Guangzhou, Peoples R China
第一作者单位	中国科学院广州能源研究所
推荐引用方式 GB/T 7714	Zhou, Weinan,Dong, Kaijun,Sun, Qin,et al. Research progress of the liquid cold plate cooling technology for server electronic chips: A review[J]. INTERNATIONAL JOURNAL OF ENERGY RESEARCH,2022:22.
APA	Zhou, Weinan.,Dong, Kaijun.,Sun, Qin.,Luo, Weimin.,Zhang, Bobo.,...&Wang, Guangwu.(2022).Research progress of the liquid cold plate cooling technology for server electronic chips: A review.INTERNATIONAL JOURNAL OF ENERGY RESEARCH,22.
MLA	Zhou, Weinan,et al."Research progress of the liquid cold plate cooling technology for server electronic chips: A review".INTERNATIONAL JOURNAL OF ENERGY RESEARCH (2022):22.