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Research progress of the liquid cold plate cooling technology for server electronic chips: A review
Zhou, Weinan1,2,3; Dong, Kaijun1,3; Sun, Qin1,3; Luo, Weimin1,3; Zhang, Bobo1,3; Guan, Shengli4; Wang, Guangwu4
2022-04-26
Source PublicationINTERNATIONAL JOURNAL OF ENERGY RESEARCH
ISSN0363-907X
Pages22
Corresponding AuthorSun, Qin(sunqinsq@hotmail.com)
AbstractA significant quantity of research has been dedicated to the application of liquid cold plates to eliminate the high heat flux in server electronic chips. Traditional parallel straight microchannel liquid cold plates suffer from low heat flux density with uneven flow distribution, which poses a serious challenge to high-performance server chip heat dissipation. This paper reviews recent research progress in geometry optimization, interrupted structures, channel patterns, and two-phase flow of liquid cold plates. The optimal geometry parameters of rectangular cross-sectional microchannels including the aspect ratio, length, and hydraulic diameter are summarized. Inquest of higher thermal performance, various interrupted structures (ribs, pin fins, etc.), special channel patterns (wavy-shaped, zigzag-shaped, fractal, serpentine, and double-layered microchannels, etc.), and two-phase flow on the liquid cold plate are applied to promote fluid-turbulivity and increase heat transfer area, meanwhile they lead to more pressure drop. Furthermore, it is an essential approach to commercialize liquid cold plates by applying the academic and prototype of the liquid cold plate to manufacturing and liquid cooling system solutions. In the end, this review provides a discussion about the limitations of current research on liquid cold plates and an outlook on future research directions.
Keywordheat transfer enhancement liquid cold plate microchannel server electronics chips
DOI10.1002/er.7979
WOS KeywordMICROCHANNEL HEAT SINK ; THERMAL-HYDRAULIC PERFORMANCE ; FLUID-FLOW CHARACTERISTICS ; FAN-SHAPED RIBS ; ASPECT RATIO ; LAMINAR-FLOW ; HYDROTHERMAL PERFORMANCE ; PRESSURE CHARACTERISTICS ; NUMERICAL OPTIMIZATION ; TRANSFER SIMULATIONS
Indexed BySCI
Language英语
Funding ProjectGuangdong Basic and Applied Basic Research Foundation[2019A1515111177] ; Guangzhou Science and Technology Project[202206010026] ; International Cooperation Project of Guangzhou Development District, China[2019GH01]
WOS Research AreaEnergy & Fuels ; Nuclear Science & Technology
Funding OrganizationGuangdong Basic and Applied Basic Research Foundation ; Guangzhou Science and Technology Project ; International Cooperation Project of Guangzhou Development District, China
WOS SubjectEnergy & Fuels ; Nuclear Science & Technology
WOS IDWOS:000787608600001
PublisherWILEY
Citation statistics
Cited Times:16[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.giec.ac.cn/handle/344007/36301
Collection中国科学院广州能源研究所
Corresponding AuthorSun, Qin
Affiliation1.Chinese Acad Sci, Guangzhou Inst Energy Convers, Guangzhou, Peoples R China
2.Univ Chinese Acad Sci, Beijing, Peoples R China
3.Guangdong Prov Key Lab New & Renewable Energy Res, Guangzhou, Peoples R China
4.Guangzhou Goaland Energy Conservat Tech Co Ltd, Guangzhou, Peoples R China
First Author AffilicationGuangZhou Institute of Energy Conversion,Chinese Academy of Sciences
Recommended Citation
GB/T 7714
Zhou, Weinan,Dong, Kaijun,Sun, Qin,et al. Research progress of the liquid cold plate cooling technology for server electronic chips: A review[J]. INTERNATIONAL JOURNAL OF ENERGY RESEARCH,2022:22.
APA Zhou, Weinan.,Dong, Kaijun.,Sun, Qin.,Luo, Weimin.,Zhang, Bobo.,...&Wang, Guangwu.(2022).Research progress of the liquid cold plate cooling technology for server electronic chips: A review.INTERNATIONAL JOURNAL OF ENERGY RESEARCH,22.
MLA Zhou, Weinan,et al."Research progress of the liquid cold plate cooling technology for server electronic chips: A review".INTERNATIONAL JOURNAL OF ENERGY RESEARCH (2022):22.
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