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印刷线路板热解过程中溴的迁移实验研究
王小玲; 赵增立; 李海滨
2011
Source Publication环境工程学报
ISSN1673-9108
Volume005Issue:006Pages:1375
Abstract选取溴化环氧树脂印刷线路板为原料,通过热重红外联用仪和热解-气相色谱/质谱联用仪对其热解过程中溴的迁移规律进行了研究。结果表明,印刷线路板主要热解温度区间在300~380℃,HB r在最大热失重处释放;PCB热解时,含溴化合物主要有溴甲烷、溴苯酚及2-溴,4-异丙基甲苯。
Language英语
Document Type期刊论文
Identifierhttp://ir.giec.ac.cn/handle/344007/21151
Collection中国科学院广州能源研究所
Affiliation中国科学院广州能源研究所
First Author AffilicationGuangZhou Institute of Energy Conversion,Chinese Academy of Sciences
Recommended Citation
GB/T 7714
王小玲,赵增立,李海滨. 印刷线路板热解过程中溴的迁移实验研究[J]. 环境工程学报,2011,005(006):1375.
APA 王小玲,赵增立,&李海滨.(2011).印刷线路板热解过程中溴的迁移实验研究.环境工程学报,005(006),1375.
MLA 王小玲,et al."印刷线路板热解过程中溴的迁移实验研究".环境工程学报 005.006(2011):1375.
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