印刷线路板热解过程中溴的迁移实验研究

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	印刷线路板热解过程中溴的迁移实验研究
	王小玲; 赵增立; 李海滨
	2011
Source Publication	环境工程学报
ISSN	1673-9108
Volume	005 Issue:006 Pages:1375
Abstract	选取溴化环氧树脂印刷线路板为原料,通过热重红外联用仪和热解-气相色谱/质谱联用仪对其热解过程中溴的迁移规律进行了研究。结果表明,印刷线路板主要热解温度区间在300～380℃,HB r在最大热失重处释放;PCB热解时,含溴化合物主要有溴甲烷、溴苯酚及2-溴,4-异丙基甲苯。
Language	英语
Document Type	期刊论文
Identifier	http://ir.giec.ac.cn/handle/344007/21151
Collection	中国科学院广州能源研究所
Affiliation	中国科学院广州能源研究所
First Author Affilication	GuangZhou Institute of Energy Conversion,Chinese Academy of Sciences
Recommended Citation GB/T 7714	王小玲,赵增立,李海滨. 印刷线路板热解过程中溴的迁移实验研究[J]. 环境工程学报,2011,005(006):1375.
APA	王小玲,赵增立,&李海滨.(2011).印刷线路板热解过程中溴的迁移实验研究.环境工程学报,005(006),1375.
MLA	王小玲,et al."印刷线路板热解过程中溴的迁移实验研究".环境工程学报 005.006(2011):1375.

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