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Thermal conductivity of methane hydrate formed from sodium dodecyl sulfate solution
Huang, DZ; Fan, SS
2004-09-01
Source PublicationJOURNAL OF CHEMICAL AND ENGINEERING DATA
Volume49Issue:5Pages:1479-1482
AbstractThe thermal conductivity of methane hydrate was measured by means of Gustafsson's transient plane source (TPS) technique. The sample was formed from 99.9 vol % methane gas with a 0.9709 mol-m(-1) aqueous sodium dodecyl sulfate (SDS) solution under 6.60 MPa and 273.15 K. The in-situ measurement was performed in the temperature range from (263.06 to 277.87) K, and the thermal conductivity of unimpacted sample was lower than that of the impacted, with values of (0.334 to 0.381) W.m(-1).K-1 and (0.564 to 0.587) W.m(-1).K-1, respectively. The results showed that the methane hydrate has glasslike thermal properties.
SubtypeArticle
WOS HeadingsScience & Technology ; Physical Sciences ; Technology
DOI10.1021/je0498098
WOS Subject ExtendedChemistry ; Engineering
WOS KeywordICE ; PHASES
Indexed BySCI
Language英语
WOS SubjectChemistry, Multidisciplinary ; Engineering, Chemical
WOS IDWOS:000223833100064
Citation statistics
Cited Times:39[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.giec.ac.cn/handle/344007/10199
Collection中国科学院广州能源研究所
Affiliation1.Chinese Acad Sci, Inst Energy Convers, Guangzhou 510640, Peoples R China
2.Chinese Acad Sci, Ctr Gas Hydrate Res, Guangzhou 510640, Peoples R China
3.Univ Sci & Technol China, Dept Thermal Sci & Energy Engn, Hefei 230026, Peoples R China
Recommended Citation
GB/T 7714
Huang, DZ,Fan, SS. Thermal conductivity of methane hydrate formed from sodium dodecyl sulfate solution[J]. JOURNAL OF CHEMICAL AND ENGINEERING DATA,2004,49(5):1479-1482.
APA Huang, DZ,&Fan, SS.(2004).Thermal conductivity of methane hydrate formed from sodium dodecyl sulfate solution.JOURNAL OF CHEMICAL AND ENGINEERING DATA,49(5),1479-1482.
MLA Huang, DZ,et al."Thermal conductivity of methane hydrate formed from sodium dodecyl sulfate solution".JOURNAL OF CHEMICAL AND ENGINEERING DATA 49.5(2004):1479-1482.
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