GIEC OpenIR  > 中国科学院广州能源研究所
An analytical solution of thermal resistance of cubic heat spreaders for electronic cooling
Feng, TQ; Xu, JL
2004-02-01
发表期刊APPLIED THERMAL ENGINEERING
卷号24期号:2-3页码:323-337
摘要A three-dimensional analytical solution using the method of Fourier expansion is developed for determination of the spreading thermal resistance of a cubic heat spreader for electronic cooling applications. The model assumes that the heat spreader is receiving a uniform heat flux centroidally with a projected heating area from the heat source. Heat is conducted inside the heat spreader in a three-dimensional coordinate, then transferred to a heat sink with a constant convective heat transfer coefficient. Dimensionless expressions in the form of infinite series are provided to compute the maximum spreading thermal resistance, the surface temperature fields and the heat flux distribution as a function of relative projected heating area, plate thickness and Biot number. The correlation developed herein is effective and accurate to predict the spreading thermal resistance. (C) 2003 Elsevier Ltd. All rights reserved.
文章类型Article
关键词Electronic Cooling Spreading Thermal Resistance Fourier Series Three-dimensional
WOS标题词Science & Technology ; Physical Sciences ; Technology
DOI10.1016/j.appltermaleng.2003.07.001
研究领域[WOS]Thermodynamics ; Energy & Fuels ; Engineering ; Mechanics
关键词[WOS]WICK STRUCTURE ; PIPE
收录类别SCI
语种英语
WOS类目Thermodynamics ; Energy & Fuels ; Engineering, Mechanical ; Mechanics
WOS记录号WOS:000187855400014
引用统计
被引频次:46[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.giec.ac.cn/handle/344007/10203
专题中国科学院广州能源研究所
作者单位Chinese Acad Sci, Guangzhou Inst Energy Convers, Guangzhou 510070, Peoples R China
推荐引用方式
GB/T 7714
Feng, TQ,Xu, JL. An analytical solution of thermal resistance of cubic heat spreaders for electronic cooling[J]. APPLIED THERMAL ENGINEERING,2004,24(2-3):323-337.
APA Feng, TQ,&Xu, JL.(2004).An analytical solution of thermal resistance of cubic heat spreaders for electronic cooling.APPLIED THERMAL ENGINEERING,24(2-3),323-337.
MLA Feng, TQ,et al."An analytical solution of thermal resistance of cubic heat spreaders for electronic cooling".APPLIED THERMAL ENGINEERING 24.2-3(2004):323-337.
条目包含的文件
条目无相关文件。
个性服务
推荐该条目
保存到收藏夹
查看访问统计
导出为Endnote文件
谷歌学术
谷歌学术中相似的文章
[Feng, TQ]的文章
[Xu, JL]的文章
百度学术
百度学术中相似的文章
[Feng, TQ]的文章
[Xu, JL]的文章
必应学术
必应学术中相似的文章
[Feng, TQ]的文章
[Xu, JL]的文章
相关权益政策
暂无数据
收藏/分享
所有评论 (0)
暂无评论
 

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。