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An analytical solution of thermal resistance of cubic heat spreaders for electronic cooling
Feng, TQ; Xu, JL
2004-02-01
Source PublicationAPPLIED THERMAL ENGINEERING
Volume24Issue:2-3Pages:323-337
AbstractA three-dimensional analytical solution using the method of Fourier expansion is developed for determination of the spreading thermal resistance of a cubic heat spreader for electronic cooling applications. The model assumes that the heat spreader is receiving a uniform heat flux centroidally with a projected heating area from the heat source. Heat is conducted inside the heat spreader in a three-dimensional coordinate, then transferred to a heat sink with a constant convective heat transfer coefficient. Dimensionless expressions in the form of infinite series are provided to compute the maximum spreading thermal resistance, the surface temperature fields and the heat flux distribution as a function of relative projected heating area, plate thickness and Biot number. The correlation developed herein is effective and accurate to predict the spreading thermal resistance. (C) 2003 Elsevier Ltd. All rights reserved.
SubtypeArticle
KeywordElectronic Cooling Spreading Thermal Resistance Fourier Series Three-dimensional
WOS HeadingsScience & Technology ; Physical Sciences ; Technology
DOI10.1016/j.appltermaleng.2003.07.001
WOS Subject ExtendedThermodynamics ; Energy & Fuels ; Engineering ; Mechanics
WOS KeywordWICK STRUCTURE ; PIPE
Indexed BySCI
Language英语
WOS SubjectThermodynamics ; Energy & Fuels ; Engineering, Mechanical ; Mechanics
WOS IDWOS:000187855400014
Citation statistics
Cited Times:35[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.giec.ac.cn/handle/344007/10203
Collection中国科学院广州能源研究所
AffiliationChinese Acad Sci, Guangzhou Inst Energy Convers, Guangzhou 510070, Peoples R China
Recommended Citation
GB/T 7714
Feng, TQ,Xu, JL. An analytical solution of thermal resistance of cubic heat spreaders for electronic cooling[J]. APPLIED THERMAL ENGINEERING,2004,24(2-3):323-337.
APA Feng, TQ,&Xu, JL.(2004).An analytical solution of thermal resistance of cubic heat spreaders for electronic cooling.APPLIED THERMAL ENGINEERING,24(2-3),323-337.
MLA Feng, TQ,et al."An analytical solution of thermal resistance of cubic heat spreaders for electronic cooling".APPLIED THERMAL ENGINEERING 24.2-3(2004):323-337.
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